尊龙凯时

CN EN
Home
About Us
Newpros
SOD-123HE Diode
SOD-123HE Diode Back
 PDF

Introduction 1.With ultra-thin package shape, it can be used in miniaturized and thin circuits；
2.The bottom side of the package has a heat sink, which has excellent heat dissipation performance；
3.There are many kinds of packaging chips, including GPP, DB, Schottky, FRED, TVS and other chips;
4. The product is made of environment-friendly materials and meets RoHS standards
5. Products are widely used in secondary rectifier circuits, converters, freewheeling diodes, AC/DC power protection and so on.
Features 1. Excellent heat dissipation performance: the back pad has large area, good heat dissipation performance and strong flow capacity, which can meet the requirements of high-temperature applications
2、Thin package shape ：the package shape is thinner than SOD-123FL package and meets the development trend of packaging thinness
SPECIFICATION
Related new products

IGBT low loss series

N100V MOSFET for Automotive Electronic Applications

C2&E3 IGBT Modules for Variable-frequency Drive

NP – sealed MOSFET for cooling fan

MT-W Series Three Phase Bridge Rectifier

Low VCE(sat)?3A?Bipolar?Transistor

TO-220AC Internal Insulated Package Series Ultra-Fast Recovery Diode

JC

SMB-W Package EM540BG

IGBT Micro Trench Discrete for PV/Eenergy Storage/ EV Charger Application
网站地图